| Processor |
| Processor cores |
10 |
| Processor frequency |
3.7 GHz |
| Processor cache |
19.25 MB |
| Processor lithography |
14 nm |
| Processor codename |
Cascade Lake |
| Processor family |
Intel Xeon W |
| Memory bandwidth supported by processor (max) |
93.85 GB/s |
| Box |
N |
| Processor ARK ID |
198016 |
| Cooler included |
N |
| Intel Volume Management Device (VMD) |
Y |
| Processor model |
W-2255 |
| Processor threads |
20 |
| Processor operating modes |
64-bit |
| Processor boost frequency |
4.5 GHz |
| Component for |
Server/Workstation |
| Technical details |
| Vendor |
Intel |
| Product type |
Processor |
| Status |
Launched |
| Launch date |
Q4’19 |
| Bus speed |
0 GT/s |
| Weight & dimensions |
| Processor package size |
45 x 52.5 mm |
| Graphics |
| Discrete graphics card |
N |
| On-board graphics card model |
Not available |
| Discrete graphics card model |
Not available |
| On-board graphics card |
N |
| Processor special features |
| Intel® AES New Instructions (Intel® AES-NI) |
Y |
| Enhanced Intel SpeedStep Technology |
Y |
| Intel Trusted Execution Technology |
Y |
| Intel VT-x with Extended Page Tables (EPT) |
Y |
| Intel Demand Based Switching |
Y |
| Intel TSX-NI |
Y |
| Intel® Secure Key |
Y |
| Intel 64 |
Y |
| Intel® OS Guard |
Y |
| Intel Virtualization Technology for Directed I (O (VT-d)) |
Y |
| Intel Software Guard Extensions (Intel SGX) |
N |
| Intel Virtualization Technology (VT-x) |
Y |
| Intel Turbo Boost Max Technology 3.0 |
Y |
| Intel® Optane™ Memory Ready |
N |
| Intel® Memory Protection Extensions (Intel® MPX) |
Y |
| Intel® Speed Shift Technology |
Y |
| AVX-512 Fused Multiply-Add (FMA) units |
2 |
| Intel® Boot Guard |
Y |
| Intel® Deep Learning Boost |
Y |
| Intel® vPro™ Platform Eligibility |
Y |
| Intel® Deep Learning Boost (Intel® DL Boost) |
Y |
| Intel® Volume Management Device (VMD) |
Y |
| Intel® Identity Protection Technology (Intel® IPT) |
Y |
| Intel® vPro™ Technology |
Y |
| Intel® Hyper Threading Technology (Intel® HT Technology) |
Y |
| Intel® Turbo Boost Technology |
2.0 |
| Features |
| Execute Disable Bit |
Y |
| Idle States |
Y |
| Thermal Monitoring Technologies |
Y |
| Scalability |
1S |
| CPU configuration (max) |
1 |
| Embedded options available |
N |
| Maximum number of PCI Express lanes |
48 |
| Physical Address Extension (PAE) |
Y 46 bit |
| Harmonized System (HS) code |
8542310001 |
| Supported instruction sets |
SSE4.2,AVX,AVX 2.0,AVX-512 |
| PCI Express CEM revision |
3.0 |
| PCI Express slots version |
3.0 |
| Power |
| Thermal Design Power (TDP) |
165 W |
| Operational conditions |
| Tcase |
62 °C |
| Memory |
| ECC |
Y |
| Maximum internal memory supported by processor |
1024 GB |
| Memory types supported by processor |
DDR4-SDRAM |
| Memory clock speeds supported by processor |
2933 MHz |
| Memory channels |
Quad |
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