| Processor |
| Processor cores |
4 |
| Processor cache |
6 MB |
| Processor manufacturer |
Intel |
| Thermal Design Power (TDP) |
65 W |
| Processor lithography |
14 nm |
| Processor codename |
Comet Lake |
| Processor cache type |
Smart Cache |
| Processor family |
10th gen Intel® Core™ i3 |
| Memory bandwidth supported by processor (max) |
41.6 GB/s |
| Box |
Y |
| Processor socket |
LGA 1200 (Socket H5) |
| Processor ARK ID |
203474 |
| Processor base frequency |
3.7 GHz |
| Processor model |
i3-10105F |
| System bus rate |
8 GT/s |
| Processor threads |
8 |
| Processor operating modes |
64-bit |
| Processor boost frequency |
4.4 GHz |
| Component for |
PC/Thin Client/Tablet |
| Technical details |
| Vendor |
Intel |
| Status |
Launched |
| Launch date |
Q1’21 |
| Supported memory types |
DDR4-SDRAM |
| Weight & dimensions |
| Processor package size |
37.5 x 37.5 mm |
| Other features |
| Maximum internal memory |
128 GB |
| Graphics |
| Discrete graphics card |
N |
| On-board graphics card model |
Not available |
| Discrete graphics card model |
Not available |
| On-board graphics card |
N |
| Processor special features |
| Intel® AES New Instructions (Intel® AES-NI) |
Y |
| Enhanced Intel SpeedStep Technology |
Y |
| Intel Trusted Execution Technology |
N |
| Intel VT-x with Extended Page Tables (EPT) |
Y |
| Intel® Secure Key |
Y |
| Intel 64 |
Y |
| Intel Stable Image Platform Program (SIPP) |
N |
| Intel® OS Guard |
Y |
| Intel Virtualization Technology for Directed I (O (VT-d)) |
Y |
| Intel Software Guard Extensions (Intel SGX) |
Y |
| Intel Virtualization Technology (VT-x) |
Y |
| Intel Turbo Boost Max Technology 3.0 |
N |
| Intel® Optane™ Memory Ready |
Y |
| Intel® Boot Guard |
Y |
| Intel® Thermal Velocity Boost |
N |
| Intel® vPro™ Platform Eligibility |
N |
| Intel® Transactional Synchronization Extensions |
N |
| Intel® Turbo Boost Technology 2.0 frequency |
4.4 GHz |
| Intel® Identity Protection Technology (Intel® IPT) |
Y |
| Intel® Hyper Threading Technology (Intel® HT Technology) |
Y |
| Intel® Turbo Boost Technology |
2.0 |
| Features |
| Execute Disable Bit |
Y |
| Idle States |
Y |
| Thermal Monitoring Technologies |
Y |
| Scalability |
1S |
| CPU configuration (max) |
1 |
| Embedded options available |
N |
| PCI Express configurations |
1×16,2×8,1×8+2×4 |
| Thermal solution specification |
PCG 2015C |
| Maximum number of PCI Express lanes |
16 |
| Market segment |
Desktop |
| Harmonized System (HS) code |
8542310001 |
| Supported instruction sets |
SSE4.1,SSE4.2,AVX 2.0 |
| Export Control Classification Number (ECCN) |
5A992C |
| Commodity Classification Automated Tracking System (CCATS) |
G077159 |
| PCI Express slots version |
3.0 |
| Operational conditions |
| Tjunction |
100 °C |
| Memory |
| ECC |
N |
| Maximum internal memory supported by processor |
128 GB |
| Memory types supported by processor |
DDR4-SDRAM |
| Memory clock speeds supported by processor |
2666 MHz |
| Memory bandwidth (max) |
41.6 GB/s |
| Memory channels |
Dual-channel |
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