Processor |
Processor cores |
4 |
Processor cache |
6 MB |
Processor manufacturer |
Intel |
Thermal Design Power (TDP) |
65 W |
Processor lithography |
14 nm |
Processor codename |
Comet Lake |
Processor cache type |
Smart Cache |
Processor family |
10th gen Intel® Core™ i3 |
Memory bandwidth supported by processor (max) |
41.6 GB/s |
Box |
Y |
Processor socket |
LGA 1200 (Socket H5) |
Processor ARK ID |
203474 |
Processor base frequency |
3.7 GHz |
Processor model |
i3-10105F |
System bus rate |
8 GT/s |
Processor threads |
8 |
Processor operating modes |
64-bit |
Processor boost frequency |
4.4 GHz |
Component for |
PC/Thin Client/Tablet |
Technical details |
Vendor |
Intel |
Status |
Launched |
Launch date |
Q1’21 |
Supported memory types |
DDR4-SDRAM |
Weight & dimensions |
Processor package size |
37.5 x 37.5 mm |
Other features |
Maximum internal memory |
128 GB |
Graphics |
Discrete graphics card |
N |
On-board graphics card model |
Not available |
Discrete graphics card model |
Not available |
On-board graphics card |
N |
Processor special features |
Intel® AES New Instructions (Intel® AES-NI) |
Y |
Enhanced Intel SpeedStep Technology |
Y |
Intel Trusted Execution Technology |
N |
Intel VT-x with Extended Page Tables (EPT) |
Y |
Intel® Secure Key |
Y |
Intel 64 |
Y |
Intel Stable Image Platform Program (SIPP) |
N |
Intel® OS Guard |
Y |
Intel Virtualization Technology for Directed I (O (VT-d)) |
Y |
Intel Software Guard Extensions (Intel SGX) |
Y |
Intel Virtualization Technology (VT-x) |
Y |
Intel Turbo Boost Max Technology 3.0 |
N |
Intel® Optane™ Memory Ready |
Y |
Intel® Boot Guard |
Y |
Intel® Thermal Velocity Boost |
N |
Intel® vPro™ Platform Eligibility |
N |
Intel® Transactional Synchronization Extensions |
N |
Intel® Turbo Boost Technology 2.0 frequency |
4.4 GHz |
Intel® Identity Protection Technology (Intel® IPT) |
Y |
Intel® Hyper Threading Technology (Intel® HT Technology) |
Y |
Intel® Turbo Boost Technology |
2.0 |
Features |
Execute Disable Bit |
Y |
Idle States |
Y |
Thermal Monitoring Technologies |
Y |
Scalability |
1S |
CPU configuration (max) |
1 |
Embedded options available |
N |
PCI Express configurations |
1×16,2×8,1×8+2×4 |
Thermal solution specification |
PCG 2015C |
Maximum number of PCI Express lanes |
16 |
Market segment |
Desktop |
Harmonized System (HS) code |
8542310001 |
Supported instruction sets |
SSE4.1,SSE4.2,AVX 2.0 |
Export Control Classification Number (ECCN) |
5A992C |
Commodity Classification Automated Tracking System (CCATS) |
G077159 |
PCI Express slots version |
3.0 |
Operational conditions |
Tjunction |
100 °C |
Memory |
ECC |
N |
Maximum internal memory supported by processor |
128 GB |
Memory types supported by processor |
DDR4-SDRAM |
Memory clock speeds supported by processor |
2666 MHz |
Memory bandwidth (max) |
41.6 GB/s |
Memory channels |
Dual-channel |
Reviews
There are no reviews yet.